Reflow – Understanding the Complete Process & Defect Prevention


With over 40 years in industry and 30 solving process problems for industry Bob Willis explains the causes and curses of most reflow issues seen in industry. Bob’s session features many unique process video clips on testing and failures and make his sessions come alive providing a much better understanding of the root cause of failure and corrective action.

Topics include:
• Design for reflow soldering
• Selecting the best solder paste
• Fundamentals of solder joint formation
• Optimising your reflow process
• Correct profiling procedures
• Correct PCB finish for your process
• Common soldering problems and why they occur
• Reliability of solder joints
• Practical testing of solder joints.

• Format: Recording
• Authors: Bob Willis
• Copyright Year: 11/14/2017
• Length: About 90 minutes

SKU: 1808011-WR Category:


The session includes solder paste testing, different reflow methods, reliable solder joint formation on high and low temperature and causes and cures of most common failures. Here we examine the most common process issues seen in the industry and how design, board selection and process materials can cause issues in manufacture. We look at the fundamentals of reflow with convection and vapour phase to understand the cause of failures.

About the Presenters:
Bob Willis currently operates a training and consultancy business based in England. He has worked with the GEC Technical Directorate as Surface Mount Co-Coordinator for both the Marconi and GEC group of companies and prior to that he was Senior Process Control Engineer with Marconi Communication Systems, where he had worked since his apprenticeship. Following his time with GEC he became Technical Director of an electronics contract manufacturing company where he formed a successful training and consultancy division. As a process engineer, he was involved in all aspects of electronic production and assembly involved in setting up production processes and evaluating materials; this also involved obtaining company approval on a wide range of Marconi’s processes and products including printed circuit board manufacture. During the period with Marconi, experience was gained in methods and equipment for environmental testing of components, printed boards and assemblies with an interest developed in many areas of defect analysis. Over the last 15 years he has been involved in all aspects of surface mounted assembly, both at production and quality level and during that time has been involved in training staff and other engineers in many aspects of modern production.

Mr. Willis was Chairman of the SMART Group, European Surface Mount Trade Association from 1990-94 and has been elected Honorary Life President and currently holds the position of SMART Group Technical Director, he also works on BSI Standards Working Parties. He is a Fellow of the Institute Circuit Technology, an NVQ Assessor, Member of the Institute of Quality Assurance and Society of Environmental Test Engineers. Bob Willis currently writes regular features for AMT Ireland, Asian Electronics Engineer and Circuits Assembly the US magazine.