With the goal to produce reliable products while achieving high yield production, this recording of a web-based tutorial provides a holistic overview on solder joint voids. Four fronts in the industry have rekindled the interest and/or concerns about solder joint voids – the lead-free solder joints; the increased use of advanced packages (BTCs, PoPs); the ever-miniaturized electronics comprising “delicate” solder joints; and the increased demand in solder joint reliability for high performance and high reliability products. Different sources of solder joint voids, their respective causes and effects on the solder joint performance and reliability will be discussed. The practiced acceptance criteria of solder joint voids vs. real-world performance, and the steps to minimize solder joint voids of both the array solder ball solder joints (e.g., PoP, BGA, CSP) and lead-frame solder joints (e.g., QFP, BTC) will be outlined. The tutorial will conclude with the source of voids that is most critical to reliability, thus to avoid.
• Driving Forces and potential effects
• Likely impact on Reliability
• Case studies
• Different Sources
• Factors contributing to each of the sources
• Role of solder alloy composition
• Mitigating approaches
• BGA voiding – additional factors
• BTC, PoP solder joint voids
• Voids criteria vs. applications
• Most critical source of voids to avoid
• Summary & recommendations
About the Presenter:
Dr. Jennie S. Hwang, a long-standing leader in SMT manufacturing and lead-free implementation, brings deep knowledge to this course through both hands-on and advisory experiences. She has provided solutions to many challenging problems, ranging from production yield to field failure diagnosis to high reliability issues. Her work covers both commercial and military applications. She has 475+ publications to her credit, including the sole authorship of several internationally-used textbooks, and is a speaker at innumerable international and national events. Dr. Hwang has received many honors and awards. Her formal education includes Harvard Business School Executive Program and four academic degrees in Metallurgical Engineering and Materials Science, Physical Chemistry, Organic Chemistry and liquid Crystal Science (Ph.D. M.S., M.S., B.S.). She has held various senior executive positions with Lockheed Martin Corp., SCM Corp, Sherwin Williams Co, and IEM Corp.