What are the Next Concerns in Counterfeit Electronics?


The counterfeit part mitigation and control plans reached a milestone in 2016 with release of the long-awaited test standard AS 6171. The year also saw release of an updated version of “Counterfeit Electrical, Electronic, and Electromechanical (EEE) Parts; Avoidance, Detection, Mitigation, and Disposition” and its accompanying aerospace recommended practices. This Webinar covers the salient elements of these published standards and the status of other related standards. In addition, the concerns on the future of counterfeit – including those of non-electronic systems, higher level assembly, tampered electronic components and systems and their relationship with the highly visible area of cyber-security. This coverage includes other sources of standards such as JEDEC and IPC and top-level analysis of reported counterfeit data.

• Format: Recording
• Authors: Dr. Diganta Das
• Copyright Year: 3/20/2017
• Length: About 90 minutes

SKU: 1808012-WR Category:


About the Presenter:
Dr. Diganta Das (Ph.D., Mechanical Engineering, University of Maryland, College Park, B.Tech, Manufacturing Science and Engineering, Indian Institute of Technology) is an Associate Research Scientist at the Center for Advanced Life Cycle Engineering. His expertise is in reliability, environmental and operational ratings of electronic parts, uprating, electronic part reprocessing, counterfeit electronics, technology trends in the electronic parts and parts selection and management methodologies. He performs benchmarking processes and organizations of electronics companies for parts selection and management and reliability practices. His current research interests include electronic parts supply chain, counterfeit electronics avoidance and detection, light emitting diode failure mechanisms, cooling systems in telecommunications infrastructure and their impact on reliability, and power electronics reliability. In addition, Dr. Das is involved in prognostics-based risk mitigation of electronics. Dr. Das has published more than 75 articles on these subjects and presented his research at international conferences and workshops. Dr. Das leads the Educational Outreach of CALCE with responsibility to develop inter-organizational agreements on joint educational programs, training and internship program, and professional development. He is an Associate Editor of the journal Microelectronics Reliability, is a Six Sigma Black Belt and a member of IEEE, IMAPS and SMTA.