This web-based tutorial focuses on the x-ray inspection of printed circuit boards. With the ever-increasing trend towards miniaturization and the use of components with non-visual inspect able criteria, x-ray as QC tool is becoming a necessity even to the Tier 1 PCBA assembly area. Devices with pads underneath the device such as QFNs, LCCCs and LGAs have become the most placed component body style. Without x-ray the inspection and quality inspection cannot be made. Couple this to other devices such as traditional BGAs and ever finer-pitch connectors and the need for x-ray imaging augmenting optical inspection is getting to be a necessity. Even older through-hole devices, with lead-free solders and large thermal masses will test the ability to create proper hole fill. Verification of this hole fill becomes increasingly necessary.Description
This tutorial has the following overarching goals:
• Understand the most important specifications in procuring a modern x-ray machine
• Understand how x-ray inspection is used to inspect a variety of electronic component body styles including leadless devices, area array devices, high density connectors, through-hole connections and standard SMT components
• Understand how x-ray inspection is used for inspection, defect analysis and troubleshooting in the SMT process
• Understand how industry standards tie in with the use of x-ray inspection
About the Presenters:
Presented by two subject matter experts, one coming from the vantage point of inspection as part of being a service provider and the other from an x-ray researcher who will come at the discussion from an imaging and machine capability standpoint. Bob Wettermann is President of BEST Inc. where he serves clients who require specialized PCB rework and repair services, solder and wire assembly training and certification and proprietary tools for making PCB rework and repair faster and simpler. IPC Master certification site. Kamran Iqbal is from Nikon Metrology.
