The web-based tutorial provides a working knowledge to all who are concerned with or interested in tin whisker and related issues in electronic packages and assemblies including designers, engineers, researchers, managers and business decision makers; also it is designed for those who desire the broad-based information.Description
For the recent years, concerns about tin whiskers have been intensifying although tin whisker issue and its potential mishaps have been recognized for more than six decades in electronic, electrical and industrial applications. The recording provides a holistic coverage on relevant aspects of tin whiskers from both physical/phenomenal occurrence and fundamental scientific perspectives. The web-based tutorial also explains why the tin whisker propensity under a study should be concluded with a specific alloy composition in conjunction with a specific system; and why a reference point is needed. Tin whisker mitigating measures and their relative effectiveness will be highlighted.
Main Topics for Part 1:
• Definition & clarification;
• Physical phenomena;
• Reference point;
• Causes and factors;
• Concerns & impact;
• Case Study.
Main Topics for Part 2:
• Reliability;
• Test conditions;
• Mitigation remedies;
• Relative effectiveness of mitigating measures;
• Plausible mechanism;
• Tin whisker vs. tin pest;
• Summary
About the Presenter:
Dr. Jennie S. Hwang, a pioneer and a major contributor to the implementation of Surface Mount manufacturing since its inception as well as to lead-free electronics, brings to the webinar her 35+ years of experience in hands-on production and as an advisor to OEMs, EMS and Defense programs. She has provided solutions to many challenging problems – from production yield to field failure diagnosis to high reliability issues. Among many honors/awards are the U.S. Congressional certificate of Recognition and Achievement, induction into WITI International Hall of Fame, named “R&D Star-to-Watch” by Industry Week, YWCA Women of Achievement Award; induction into the National Academy of Engineering. She is the author of 500+ publications and several ground-breaking books on SMT manufacturing and lead-free technology and manufacturing and is an invited speaker in numerous international and national events. Additionally, she has served on the Board of NYSE Fortune 500 companies, and on various civic, government and university boards and committees. She chairs the Board of the Assessment of Army Research Laboratory of DoD, of the National Institute of Standard and Technologies, and has been an advisor and a reviewer of government programs (DoD, NASA, NIST, etc.) and various publications. She also serves on the National Manufacturing and Materials Board, National Laboratory Assessment Board, and Board of Army Science & Technology. Her formal education includes Harvard Business School Executive Program and four academic degrees (Ph.D. in Metallurgical Engineering & Materials Science, M.S. in Physical Chemistry, M.S. in Liquid Crystal Science, B.S. in Chemistry). She has held senior executive positions with Lockheed Martin Corp., SCM Corp, Sherwin Williams Co, and International Electronic Materials Corp. She is president of H-Technologies Group and is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University and serves on the University’s Board of Trustees.
